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Certification : ISO, UL, IPC, Reach
Place of Origin : China
MOQ : 1
Price : Contact us
Payment Terms : T/T
Delivery Time : 5-30 days
Layer : 12 Layer
Material : FR4
Board Thickness : 2.5mm
Surface Finish : Immersion Gold
Pin Space : 0.25mm
Application : Electronic Products
12 Layer Industrial Control SMT PCB Assembly
♦ What Is Electronics PCB Components Assembly?
Electronics PCB Components Assembly (also called PCBA – Printed Circuit Board Assembly) is the process of mounting and soldering electronic components onto a bare PCB to create a functional circuit board. This process transforms a blank PCB into a working electronic device, such as a smartphone, computer, or IoT gadget.
♦ Key Stages of PCB Components Assembly:
There are two primary assembly techniques:
Step | Description |
---|---|
1. Solder Paste Printing | A stencil applies solder paste to PCB pads. |
2. Component Placement | Pick-and-place machines position SMD components. |
3. Reflow Soldering | Heats PCB to melt solder and form connections. |
4. Through-Hole Insertion | THT components are manually/machine-inserted. |
5. Wave Soldering (THT) | Solder bonds THT components to the board. |
6. Inspection & Testing | AOI (Automated Optical Inspection), X-ray (for BGAs), functional testing. |
7. Conformal Coating (Optional) | Protects PCB from moisture, dust, and corrosion. |
DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: sales@dqspcba.com
♦ Technical Parameters
PCB Assembly Capability | |||||
Item |
Normal |
Special | |||
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm |
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Electronics SMT PCB SMD Assembly Components 12 Layer OEM Images |